NSN 5962-01-182-0553

Part Details | MEMORY MICROCIRCUIT

5962-01-182-0553 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM FAMILY 008, ROM/PROM FAMILY 008, 3365462901, 336546-2901, M3851020402BEA, M38510/20402BEA, 336562901, 33656-2901, 3365462901, 336546-2901, 5962-01-182-0553, 01-182-0553, 5962011820553, 011820553

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JUN 19, 198401-182-055341015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-182-0553
Part Number Cage Code Manufacturer
ROM/PROM FAMILY 00816236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
336546-29016S055DPA LABS, INC.DBA DPA COMPONENTS INTERNATIONAL
M38510/20402BEA81349MILITARY SPECIFICATIONSPROMULGATED BY MILITARY
33656-290122915NORTHROP GRUMMAN CORPELECTRONIC SYSTEMS DEFENSIVE SYSTEM
336546-290122915NORTHROP GRUMMAN CORPELECTRONIC SYSTEMS DEFENSIVE SYSTEM
Technical Data | NSN 5962-01-182-0553
Characteristic Specifications
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICADT85.00 NANOSECONDS MAXIMUM
MEMORY DEVICE TYPE PROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
MAXIMUM POWER DISSIPATION RATING794.0 MILLIWATTS
FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).