NSN 5962-01-175-0304

Part Details | MEMORY MICROCIRCUIT

5962-01-175-0304 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM FAMILY 020, ROM/PROM FAMILY 020, 7802201JB, D27161, D2716-1, 2014063010, 2014063-010, 2014063010, 2014063-010, 5962-01-175-0304, 01-175-0304, 5962011750304, 011750304

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAR 26, 198401-175-030441015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-175-0304
Part Number Cage Code Manufacturer
ROM/PROM FAMILY 02016236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
7802201JB16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
D2716-134649INTEL CORP SALES OFFICE
2014063-0101PQF4L3 TECHNOLOGIES, INC.DBA LINK SIMULATION & TRAINING
2014063-01036378RAYTHEON TECHNICAL SERVICES COMPANY
Technical Data | NSN 5962-01-175-0304
Characteristic Specifications
OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 14 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACVM0.3 VOLTS MINIMUM AND ACV6.0 VOLTS MAXIMUM
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +100.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC AND GLASS
CASE OUTLINE SOURCE AND DESIGNATORD-3 MIL-M-38510
BODY LENGTH1.290 INCHES MAXIMUM
BODY HEIGHT0.210 INCHES NOMINAL
BODY WIDTH0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING635.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +125.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND MONOLITHIC AND PROGRAMMABLE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).