NSN 5962-01-171-5580
Part Details | MEMORY MICROCIRCUIT
5962-01-171-5580 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: DH760522, DH76052-2, ROMPROM FAMILY 078, ROM/PROM FAMILY 078, RY4289002, RY4289-002, N0078102, N0078-102, HM7685, HM-7685, 53S841, 19581, CC6323102, CC6323-102, 82S185, 932905102, 932905-102, 9328921B, 932892-1B, 5962-01-171-5580, 01-171-5580, 5962011715580, 011715580
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | FEB 09, 1984 | 01-171-5580 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-171-5580
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| DH76052-2 | 34335 | ADVANCED MICRO DEVICES, INC.DBA A M D |
| ROM/PROM FAMILY 078 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| RY4289-002 | 07933 | FAIRCHILD SEMICONDUCTOR CORPSEMICONDUCTOR DIV HQ |
| N0078-102 | 34371 | INTERSIL CORPORATIONDIV NA |
| HM-7685 | 34371 | INTERSIL CORPORATIONDIV NA |
| 53S841 | 50364 | MMI/AMD |
| 19581 | 50364 | MMI/AMD |
| CC6323-102 | 18324 | PHILIPS SEMICONDUCTORS INC |
| 82S185 | 18324 | PHILIPS SEMICONDUCTORS INC |
| 932905-102 | 82577 | RAYTHEON COMPANYDBA RAYTHEON |
| 932892-1B | 82577 | RAYTHEON COMPANYDBA RAYTHEON |
Technical Data | NSN 5962-01-171-5580
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 12 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACVM0.5 VOLTS MINIMUM AND ACV7.0 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | AEE125.00 NANOSECONDS MAXIMUM AND AED125.00 NANOSECONDS MAXIMUM |
| MEMORY DEVICE TYPE | ROM |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 18 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| BODY LENGTH | 0.520 INCHES MAXIMUM |
| BODY HEIGHT | 0.085 INCHES MAXIMUM |
| BODY WIDTH | 0.390 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 715.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | BIPOLAR AND PROGRAMMABLE AND 3-STATE OUTPUT |
| TEST DATA DOCUMENT | 82577-932892 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |