NSN 5935-00-016-0429

Part Details | PLUG-IN ELECTRONIC COMPONENTS SOCKET

5935-00-016-0429 An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting "power transistors".

Alternate Parts: SJ424, 690120424, 69012-0424, SJ424, 690120424, 69012-0424, 4146352, 414635-2, 5935-00-016-0429, 00-016-0429, 5935000160429, 000160429

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 01, 196100-016-042928914 ( SOCKET, PLUG-IN ELECTRONIC COMPONENTS )
REFERENCE DRAWINGS & PICTURES

TOP MOUNT, PRESS FIT

ROUND, BODY

RECTANGULAR

Cross Reference | NSN 5935-00-016-0429
Part Number Cage Code Manufacturer
SJ42428499CHEMLEC PRODUCTS INC
69012-042428499CHEMLEC PRODUCTS INC
SJ42473680GARLOCK SEALING TECHNOLOGIES LLCDBA GARLOCK SEALING TECHNOLOGIES
69012-042473680GARLOCK SEALING TECHNOLOGIES LLCDBA GARLOCK SEALING TECHNOLOGIES
414635-296214RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5935-00-016-0429
Characteristic Specifications
CONTACT POSITION ARRANGEMENT STYLE RECTANGULAR
ACCOMMODATED CONTACT QUANTITY4
CONTACT MATERIAL BRASS
CONTACT SURFACE TREATMENT NICKEL AND U0000 ANY ACCEPTABLE
BODY STYLE TOP MOUNT, PRESS FIT
TERMINAL LENGTH0.170 INCHES NOMINAL
OVERALL HEIGHT0.438 INCHES NOMINAL
OVERALL DIAMETER0.400 INCHES NOMINAL
PROJECTION LENGTH ABOVE MOUNTING SURFACE0.060 INCHES NOMINAL
BODY MATERIAL PLASTIC
TERMINAL TYPE AND QUANTITY4 PIN
MOUNTING TYPE FOR WHICH DESIGNED CHASSIS
MOUNTING METHOD PRESS FIT
MOUNTING HOLE STYLE ROUND, BODY
BODY MOUNTING HOLE ACCOMMODATION DIAMETER0.370 INCHES MINIMUM AND 0.375 INCHES MAXIMUM
SPECIFIC EQUIPMENT ACCOMMODATEDSEMICONDUCTOR DEVICE
FABRICATION METHOD MOLDED
PRECIOUS MATERIAL GOLD
PRECIOUS MATERIAL AND WEIGHT0.020 GOLD GRAINS, TROY
PRECIOUS MATERIAL AND LOCATIONCONTACT SURFACES GOLD